What you need to know
- A new patent shows a potential heat transfer system for the Surface Neo and Surface Duo.
- The patent shows a vapor chamber extending across the hinge of a device.
- As with all patents revealed, this design might never be used in a device.
A newly revealed patent shows off a potential cooling system for the upcoming Surface Neo and Surface Duo (via Windows United). The patent shows heat pipes and vapor chambers extending across the hinge of a device.
The Surface Neo and Surface Duo appear to be very thin devices, which could increase the importance of well-designed thermal dissipation.
The patent was published on November 21, 2019, and filed for on May 17, 2018. Its description explains how a vapor chamber could help cool the device by extending through the hinge.
Examples are disclosed that relate to heat transfer devices comprising a vapor chamber and a flexible hinge. One disclosed example provides an electronic device comprising a first portion and a second portion connected by a hinge region, and a vapor chamber extending from the first portion to the second portion across the hinge region, the vapor chamber comprising a first layer comprising titanium, a second layer comprising titanium joined to the first layer to form the vapor chamber, a working fluid within the vapor chamber, and a third layer comprising titanium positioned between the first layer and the second layer, the third layer comprising one or more features configured to conduct the working fluid via capillary action."
As with all patents, this design could not be used in the future. It could also be used in a different way or as part of a different device.
